Since the age of lndustrialization, Lead (Pb) has successfully been used in the manufacture of electrical andelectronic equipment. But in recent years, studies have shown that if discarded lead-based electronic productscontinue to fill up landfill sites, it will lead to environmental catastrophe. Be it legislative, environmental, publicsentiments or market drivers, Pb bearing commercial products - electronics will have to go!
自工业化时代开始，铅已成功的被用于电器和电子设备的制造。但近年来，研究显示如果弃置的含铅电子产品继续的填满土地，会导致环受污染。在立法、环境、公众的要求或市场的驱动下，含铅的电子产品必将被取代。
The alternative material for making electronic interconnections is 'Pb Free'Solder, which is on the everincreasing demand since. This is a tight timescale for any manufacturing transition to the new lead-free solderingtechnoloaies, and its immediate actions are starting as soon as possible to meet the requirements.
可供替代制造电子相关材料的无铅焊锡，正在不断的增加需求中。制造工艺过渡到新的无铅焊接工艺，有一个紧迫的时间表，必须尽快的采取行动以达到无铅时代的要求。
At Hongjia, we are capable to offer custom alloy development for specific temperature requirements and for otherspecial applications, Or we can provide an alloy for your specific application that will meet your requirements.
我们宏嘉公司有能力提供特定温度要求和特别用途的合金。我们也能提供顾客特定用途的合金以达到顾客的要求。
Mid-Range TemperatureLead freealloys 中温范围无铅合金
Product Code
产品编号
|
Alloy Composition
合金
|
Solidus(℃)
固相线温度
|
Liquidus(℃)
液相线温度
|
Remarks
备注
|
|
H37E
|
Sn99.3/Cu0.7+Re
|
227
|
EUTECTIC
共晶熔点
|
Mid-range temperature.good alternative to sacalloy forlead free soldering
中温范围替代SAC合金于无铅焊接
|
|
H64E
|
Sn99.6/Cu0.4+Re
|
227
|
230
|
|
H37R
|
Sn99.3/Cu0.7+Re
|
227
|
EUTECTIC
共晶熔点
|
|
H64R
|
Sn99.6/Cu0.4+Re
|
227
|
230
|
|
H36E
|
Sn99.3/Cu0.6/Ni+Re
|
227
|
EUTECTIC
共晶熔点
|
|
H91E
|
Sn99/Cu/Ni+Re(Low copper)
|
227
|
230
|
|
H36L
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Sn99.3/Cu0.6/Ni+Re
|
227
|
EUTECTIC
共晶熔点
|
|
H91F
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Sn99/Cu/Ni+Re(Low copper)
|
227
|
230
|
High Temperature Lead free alloys 高温无铅合金
Product Code
产品编号
|
Alloy Composition
合金
|
Solidus(℃)固相温度
|
Liquidus(℃)
液相温度
|
Remarks备注
|
|
H55G
|
Sn95/Sb5.0
|
235
|
240
|
High temperature alloy
高温合金
|
|
H52G
|
Sn95/Sb2.0
|
227
|
280
|
High temperature alloy
高温合金
|
|
H73G
|
Sn97/Cu3.0
|
227
|
300
|
High temperature alloy
高温合金
|
HongjiaH305Lead free Bar 宏嘉H305 无铅锡条
HJ-307B Pb-Free solder is a general purpose low dross solder alloy of high purity Sn, Ag & Cu, process via Hongia proprietary purification method. This alloy combination is favored by the electronic industry to replace theconventionalPb bearing solders.
H305无铅锡条，是宏嘉以独特净化方式生产的一般用途、低渣、高纯度锡-银-铜合金。是这种合金组合受到电子工业界的推崇，以之用来取代的传统的含铅锡条。
HJ-305 alloy combinations conform & exceed the impurities requirements of major international standards. These are the desired H305 bar qualities.
· Good mechanical strength & electrical conductivity 机械性能好，导电性好
· Cost competitive 成本具竞争力
· Low melting point 低熔点
· Low dross 低
Hong jia H037 Lead free Bar 宏嘉 H307 无铅锡条
H037 Pb-Free solder is general purpose low dross solder alloy of Sn, Ag & Cu alloy combination design with these are soldering properties of the LF307B bar, but a cheaper alternatives to popular SAC bar.
H037无铅锡条也是宏嘉一般用途、低渣锡-银-铜合金组合。这种合金组合被设计为拥有与 H305无铅锡条同等的焊接性能，同时相比流行SAC锡条更便宜。
H037 alloy combinations conform & exceed the impurities requirements of major international standards. These are the dosired H037 bar qualities:
HO37合金组合的杂质含量要求符合并优于常用的国际标准。以下为HJ-315B锡条的品质:
· Good Wetting 优良的流动性
· Good through hole fill 优良的通孔填充
· Minimal hot tear 最小化的热撕裂
· Comparable reliability toSAC 与SAC可比的可靠性能
· Low Cost 低成本
Hongjia H37E Lead free Bar 宏嘉H37E 无铅锡条
H37E was developed to offer a technically superior and more economical option to other lead free alloys. This nickel stabilized tin/copper alloy gives bridge-free wave soldering at temperatures normally used with tin/lead alloys.
H37E被开发为一种相比其他无铅合金拥有更高的技术水平和更经济的合金。在用于普通锡-铅合金的温度下，这种锡-铜-稀土合金可以提供出无锡桥波峰焊接。
Plus nickel to the tin-copper eutectic offers the following advantages:
加稀土于锡-铜共晶具有下列好处:
· Low cost lead free aloy 低成本无铅合金
· Low dross formation 低渣
· Bright, smooth solder joints that is free from gross micro cracks 光滑焊点，无裂痕。
· Good through hole penetration 好的穿孔能力
· Low rate of copper leaching 铜的溶出速度低。
· Less aggressive on stainless steel& other solder pot materials 对不锈钢和其他焊锡锅材料腐蚀作用低
· Easy to maintain alloy composition 容易保持合金成份
Addition of nickel to the tin-copper eutectic offers the following advantages：
锡铜共晶中加入稀土，稀土的方法可以提供如下优点:
· Low cost lead free alloy 低成本无铅合金
· Low dross than other lead free alloy 相比其它无铅合金更低的残渣
· Excellent fluidity with very uniform and flat surfaces 在整平的表面优良的流动性。
· Bridge free coating and fine pitch circuitry 无桥涂装和细距电路
· Low copper erosion 减少的铜腐蚀
· Good shelf life 优良的保质期
· Minimal attackon stainless steel pot 对不锈钢炉减少的侵蚀
· Close to eutectic temperature 接近于共晶熔点
· Easy to manage alloy composition 易于管理合金成份
· Compatible with both 63/37 and lead free final assembly 与63/37 合金和无铅最终装配相一致
Application 应用
Recommended process parameters 推荐工艺参数
|
Recommendedprocess Setting推荐工艺设定
|
|
PROCESS PARAMETERS工艺参数
|
H37E
|
H305
|
H037
|
|
SolderTemperature焊接温度
|
250℃-270℃
|
245℃-255℃
|
250℃-260℃
|
|
Pre-heat 预热
|
100℃-130℃
|
100℃-130℃
|
100℃-130℃
|
|
ConveyerSpeed传送速度
|
0.7mm-1.0m/min
|
1.0m-1.5m/min
|
1.0m-1.5m/min
|
|
ContactTime接触时间
|
3.0s-4.0s
|
2.5s-3.5s
|
2.0-3.0s
|
Physical Appearance 外观
Hond ia series bars are produce with either manuallv casted bars or extruded bars that exhibits a uniform colour. The brand & product code will be embossed onto it. Each bar weiahs between 500-800 ams. We also produce larger bar size between 2-3 kg type for some special application.
宏嘉无铅系列锡条分为铸条或呈现均匀光泽的挤条。锡条上印有品牌和产品编号。一根锡条重量为1000g，我们也生产较大锡条，2-3kg.供特别用途。
Packaging 包装
The standard packaging for Hong jia LF-300B series bars is 20kg per box both manually casted and extruded bars For larger size bars, these will be palletized. All boxes will be traceable by their lot numbers.
宏嘉无铅系列锡条的标准包装是铸条 20kg一箱，挤条20kg一箱。较大锡条则放在卡板上。所有包装盒上都标有生产批号。
Storage 贮存
There is no shelf life for our LF-300B series bars, To minimize the bars from further oxidation, ensure that the packaging is not damaged & the bars are not exposed to dust & other foreign materials.
LF-300B系列锡条没有期限规定，为了减少锡条受到氧化，确保包装不破损，锡条不曝于灰尘和其他特质。
Delivery 交货
Each order can be shipped with the certificate of analysis for each lot.
交货同时附上分析证明书。
MaterialSafety DataSheet 材料安全数据单
A MSDS for this product can be request from our Sales personnel.
产品的MSDS可向销售部索限.
Technical&CustomerServiceSupport 技术&客户服务
For more information our Lead free bars as well as our other products, please call fax or email us. Our sales Engineers will be most glad to answer your enguires as well as recommend the most suitable product for your application. Our Customer Service personnel are also available to provide you with our competitive quotation quotation as well as expedite vour orders & provide you with any assistance you may reguire.
欲知无铅锡条或我们其他的产品，请用电话、传真或电邮给我们。我们的销售工程师将很乐意的给予解答和介绍最适合您的用途的产品。我们的销售工程师会提供您具竞争力的服价，并尽快的交货和提供您所需的协助。
